nsBAS EN IEC 62769-4:2024

Field Device Integration (FDI®) - Part 4: FDI Packages


General information
Status:Project
Number of pages:98
Adoption method:Proglašavanje
Language:engleski
Edition:1.
Realization date:24.04.2024
Forseen date for next stage code:16.06.2024
Technical committee:BAS/TC 51, Automation
ICS:
25.040.40, Industrial process measurement and control
35.100.05, Multilayer applications

Abstract
<!-- NEW! -->IEC 62769-4:2023 is available as <a href="https://webstore.iec.ch/publication/84633">IEC 62769-4:2023 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 62769-4:2023 specifies the FDI®[1] Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Architecture diagram figure. [1] FDI® is a registered trademark of the non-profit organization Fieldbus Foundation, Inc. This information is given for the convenience of users of this document and does not constitute an endorsement by IEC of the trademark holder or any of its products. Compliance does not require use of the trade name. Use of the trade name requires permission of the trade name holder.

Lifecycle
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Original document and degree of correspondence
EN IEC 62769-4:2023, identical
IEC 62769-4:2023, identical

Relation to BAS standards

Work material

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