BAS EN IEC 62769-4:2022
Field Device Integration (FDI) - Part 4: FDI Packages
General Information
Status: Published
No. of pages: 90
Language: English
Edition: 2.
Adoption method: Endorsment
Publication date: 02.08.2022
Technical committee:
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Abstract
This part of IEC 62769 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in Figure 1.
[Figure 1 - FDI architecture diagram]
Lifecycle
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Original document and degree of correspondence
- EN IEC 62769-4:2021, identical
- IEC 62769-4:2021, identical