Showing 81-100 of 2,550 items.
| Standard reference | Stage code | BAS/TC | Real date | Forseen date for next stage code |
|---|---|---|---|---|
| nsBAS EN IEC 60749-10:2026 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 60749-28:2026 Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 60749-34-1:2026 Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 60749-37:2026 Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 60749-39:2026 Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 60749-5:2026 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61031:2026 Nuclear facilities - Instrumentation and control systems - Design, location and application criteria for installed area gamma radiation dose rate monitoring equipment for use during normal operation and anticipated operational occurrences | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61098:2026 Radiation protection instrumentation - Installed personnel surface contamination monitors | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61124:2026 Reliability testing - Compliance tests for constant failure rate and constant failure intensity | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61162-1:2026 Maritime navigation and radiocommunication equipment and systems - Digital interfaces - Part 1: Single talker and multiple listeners | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61162-2:2026 Maritime navigation and radiocommunication equipment and systems - Digital interfaces - Part 2: Single talker and multiple listeners, high-speed transmission | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61162-450:2026 Maritime navigation and radiocommunication equipment and systems - Digital interfaces - Part 450: Multiple talkers and multiple listeners - Ethernet interconnection | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61188-6-3:2026 Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-501:2026 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-720:2026 Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-801:2026 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-803:2026 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-804:2026 Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-805:2026 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |
| nsBAS EN IEC 61189-2-807:2026 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA | 40.20 | BAS/TC 64 | 26.02.2026 | 26.04.2026 |