prBAS EN IEC 63378-3:2026

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

General information

Status:Project

Number of pages:32

Adoption method:Proglašavanje

Language:engleski,francuski

Edition:1.

Realization date:04.11.2025

Forseen date for next stage code:19.11.2025

Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization

ICS:

31.080.01, Semiconductor devices in general

Abstract

IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification. This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.

Lifecycle

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Original document and degree of correspondence

EN IEC 63378-3:2025, identical

IEC 63378-3:2025, identical

Work material

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