BAS EN ISO 9455-17:2009
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
General Information
Status: Published
No. of pages: 23
Language: English
Edition: 1.
Adoption method: Endorsment
Publication date: 31.08.2009
Technical committee:
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Abstract
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders.
This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Lifecycle
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Original document and degree of correspondence
- EN ISO 9455-17:2006, identical
- ISO 9455-17:2002, identical