prBAS EN IEC 62878-2-603:2026
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
General information
Status:Project
Number of pages:28
Adoption method:Proglašavanje
Language:engleski,francuski
Edition:1.
Realization date:04.11.2025
Forseen date for next stage code:19.11.2025
Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization
ICS:
31.180, Printed circuits and boards
31.190, Electronic component assemblies
31.190, Electronic component assemblies
Abstract
IEC 62878-2-603:2025 specifies the electrical test method to detect electrical connectivity defects of the stacked electronic module caused by the stacking assembly process to stack some stackable electronic modules. This method is realized to make use of bidirectional serial communication bus interface applied to the stackable electronic modules which are assured as "known good module" (KGM).
Lifecycle
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Original document and degree of correspondence
EN IEC 62878-2-603:2025, identical
IEC 62878-2-603:2025, identical
Work material
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