prBAS EN IEC 61189-2-808:2026

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

General information

Status:Project

Number of pages:43

Adoption method:Proglašavanje

Language:engleski,francuski

Edition:1.

Realization date:04.11.2025

Forseen date for next stage code:19.11.2025

Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization

ICS:

31.180, Printed circuits and boards

Abstract

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

Lifecycle

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Original document and degree of correspondence

EN IEC 61189-2-808:2024, identical

IEC 61189-2-808:2024, identical

Work material

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