prBAS EN IEC 61189-2-808:2026

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Opće informacije

Status:Projekt

Broj stranica:43

Metoda usvajanja:Proglašavanje

Jezik:engleski,francuski

Izdanje:1.

Nadnevak realizacije:04.11.2025

Predviđeni nadnevak naredne faze:19.11.2025

Tehnički komitet:BAS/TC 64, VS2 - Elektrotehnička standardizacija

ICS:

31.180, Štampani krugovi i ploče

Apstrakt

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink. NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

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IEC 61189-2-808:2024, identičan

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