prBAS EN IEC 61189-2-807:2026

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA

General information

Status:Project

Number of pages:20

Adoption method:Proglašavanje

Language:engleski,francuski

Edition:1.

Realization date:04.11.2025

Forseen date for next stage code:19.11.2025

Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization

ICS:

31.180, Printed circuits and boards

Abstract

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (<em>T</em><sub>d</sub>) of base laminate materials using thermogravimetric analysis (TGA).

Lifecycle

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Original document and degree of correspondence

EN IEC 61189-2-807:2021, identical

IEC 61189-2-807:2021, identical

Work material

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