Invitation to the webinar – Resistance measurement method on the thermoformable conducting layer (IEC 62899-202-10)
This 60-minute webinar will introduce IEC TC 119’s work on Printed Electronics and the most recent standard that was developed in this TC.
IEC 62899-202-10 is the first-ever standard on in-mould electronics (IME) technology. The standard defines the terminology and measurement methods for characterizing the resistance change of conductive ink layers as a function of thermoplastic elongation.
Creating smart functional electronics with IME technology requires thermoforming, i.e. creating 3D shapes from flat 2D functional films with printed circuitry and mounted components. Thermoforming elongates the printed layers causing resistivity changes that should be considered during the design phase. Using a standardized measurement method ensures comparability of the results and leads to optimization of the designs/materials.
This webinar will give participants an overview of the in-mould electronics technology, and the measurement method.
This session is part of our series of webinars focusing on new publications, covering new standards, guides, reports, white papers and other important publications relevant to standards users.
The date of the online event is February 14, 2024.