prBAS EN IEC 60749-37:2026
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Opće informacije
Status:Projekt
Broj stranica:45
Metoda usvajanja:Proglašavanje
Jezik:engleski,francuski
Izdanje:2.
Nadnevak realizacije:04.11.2025
Predviđeni nadnevak naredne faze:19.11.2025
Tehnički komitet:BAS/TC 64, VS2 - Elektrotehnička standardizacija
ICS:
31.080.01, Poluprovodnički uređaji općenito
Apstrakt
<!-- NEW! -->IEC 60749-37:2022 is available as <a href="https://webstore.iec.ch/publication/79480">IEC 60749-37:2022 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
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EN IEC 60749-37:2022, identičan
IEC 60749-37:2022, identičan
Veza sa BAS standardima
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