BAS EN 60749-37:2011
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using a accelerometer
General Information
Status: Published
No. of pages: 47
Language: English, French
Edition: 1.
Adoption method: Endorsment
Publication date: 31.10.2011
Technical committee:
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Abstract
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
Lifecycle
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Original document and degree of correspondence
- EN 60749-37:2008, identical
- IEC 60749-37:2008, identical