prBAS EN IEC 61189-2-809:2026

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

General information

Status:Project

Number of pages:20

Adoption method:Proglašavanje

Language:engleski,francuski

Edition:1.

Realization date:04.11.2025

Forseen date for next stage code:19.11.2025

Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization

ICS:

31.180, Printed circuits and boards

Abstract

IEC 61189-2-809:2024 defines the method to be followed for the determination of the X/Y coefficient of thermal expansion of electrical insulating materials by the use of a thermomechanical analyser (TMA). This method is applicable to materials that are solid of the entire range of temperature used and retain sufficient hardness and rigidity over the temperature range so that irreversible indentation of the specimen by the sensing probe does not occur.

Lifecycle

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Original document and degree of correspondence

EN IEC 61189-2-809:2025, identical

IEC 61189-2-809:2024, identical

Work material

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