prBAS EN IEC 61188-6-3:2026
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
General information
Status:Project
Number of pages:65
Adoption method:Proglašavanje
Language:engleski,francuski
Edition:1.
Realization date:04.11.2025
Forseen date for next stage code:19.11.2025
Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization
ICS:
31.180, Printed circuits and boards
31.190, Electronic component assemblies
31.190, Electronic component assemblies
Abstract
IEC 61188-6-3:2024 specifies the requirements for lands and land pattern on circuit boards for the mounting of components with leads by soldering based on the solder joint requirements of IEC 61191-1 and IEC 61191-3.
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through hole mounted components. These requirements are based on the solder joint requirements of IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4.
This first edition partially cancels and replaces the IEC 61188-5 series of International Standards.
The significant technical changes with respect to the previous edition are listed in the Introduction and further detailed information and calculations can be found in Annex A.
Lifecycle
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Original document and degree of correspondence
EN IEC 61188-6-3:2025, identical
IEC 61188-6-3:2024, identical
Work material
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