prBAS EN IEC 61249-2-51:2026
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
General information
Status:Project
Number of pages:35
Adoption method:Proglašavanje
Language:engleski,francuski
Edition:1.
Realization date:04.11.2025
Forseen date for next stage code:19.11.2025
Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization
ICS:
31.180, Printed circuits and boards
Abstract
IEC 61249-2-51:2023 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Lifecycle
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Original document and degree of correspondence
EN IEC 61249-2-51:2023, identical
IEC 61249-2-51:2023, identical
Work material
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