prBAS EN IEC 63251:2026

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress


General information
Status:Project
Number of pages:45
Adoption method:Proglašavanje
Language:engleski,francuski
Edition:1.
Realization date:04.11.2025
Forseen date for next stage code:19.11.2025
Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization
ICS:
31.180, Printed circuits and boards

Abstract
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this standard specifies a test method to inspect the occurrence of color exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.

Lifecycle
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Original document and degree of correspondence
EN IEC 63251:2023, identical
IEC 63251:2023, identical

Work material

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