prBAS EN IEC 61189-2-804:2026

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

General information

Status:Project

Number of pages:19

Adoption method:Proglašavanje

Language:engleski,francuski

Edition:1.

Realization date:04.11.2025

Forseen date for next stage code:19.11.2025

Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization

ICS:

31.180, Printed circuits and boards

Abstract

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

Lifecycle

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Original document and degree of correspondence

EN IEC 61189-2-804:2023, identical

IEC 61189-2-804:2023, identical

Work material

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