prBAS EN IEC 60749-37:2026

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer


Opšte informacije
Status:Projekt
Broj stranica:45
Metoda usvajanja:Proglašavanje
Jezik:engleski,francuski
Izdanje:2.
Datum realizacije:19.11.2025
Predviđeni datum naredne faze:15.01.2026
Tehnički komitet:BAS/TC 64, VS2 - Elektrotehnička standardizacija
ICS:
31.080.01, Poluprovodnički uređaji općenito

Apstrakt
IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition: - correction of a previous technical error concerning test conditions; - updates to reflect improvements in technology.

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EN IEC 60749-37:2022, identičan
IEC 60749-37:2022, identičan

Veza sa BAS standardima

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